上海原裝進(jìn)口松下芯片倒裝底填膠CV5300AK01EPS

CV5300AK

TECHNICAL INFORMATION

Encapsulation Materials Department Plastic Materials Business Unit Electronic Materials Business Division

Panasonic Industory Co., Ltd

This is one component epoxy for Flip-chip underfilling.

TYPICAL PROPERTIES

Properties

Unit

Data

Test Method

Viscosity(25oC)

Pa*s

20

KES-B-0102

Gelation time

sec

800

EKS-B-1051

RECOMMENDING PREHEAT CONDITION

temperature of substrate : 80～120oC

temperature of syringe : R.T.～ 60oC

TYPICAL CURED PROPERTIES

Measurement Cure Conditions : 100'C2hour + 150`C 2hour

?Stored compound must be thawed before use. Warm at room temperature until no longer cool to touch (about 2hrs).

?Please use up the material within 12 hrs.

?Compound must be stored in the cool condition with sealing.

?Please keep material under -40oC after receiving product.

ATTENTION TO HANDLING

?Please avoid direct contact with this product by wearing gloves, protecting gears,etc.

?Prevent frequent skin contact. If contact occurs, wash immediately with soap and water.

上海原裝進(jìn)口松下芯片倒裝底填膠CV5300AK01EPS

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公司主要致力于為L(zhǎng)ED照明、家用電器、消費(fèi)電子、集成電路封裝、光通信、新能源電池、汽車零部件、電源模塊、風(fēng)電、AR眼鏡、智能水表、電機(jī)等行業(yè)用膠方案的提供。在膠粘劑方面，公司注重新材料的開(kāi)發(fā)和應(yīng)用，不斷提升用膠產(chǎn)品的品質(zhì)和性能，提高國(guó)內(nèi)生產(chǎn)型企業(yè)產(chǎn)品在國(guó)內(nèi)國(guó)際市場(chǎng)的競(jìng)爭(zhēng)力。積極配合和制定相關(guān)產(chǎn)品的粘結(jié)方案，解決行業(yè)內(nèi)產(chǎn)品用膠難點(diǎn)的突破。