日本日亞405nm 6868 365nm 平窗120石英玻璃片封裝 3D打印機(jī)固化燈

參數(shù)

電流 Forward Current 700mA

電壓 Forward Voltage 3.5-3.9V

電功率 Power Dissipation 3.08W

光功率 Radiant Flux 800mW/cm2

峰值波長(zhǎng) Peak Wavelength 405nm

封裝尺寸：6868 6.8*6.8*1.9 L*W*H(mm)

詢問(wèn)中文詳細(xì)規(guī)格書可以聯(lián)系我，先看原文件截圖

散熱和焊接使用注意事項(xiàng)，需要中文的直接聯(lián)系我簡(jiǎn)妮

Thermal Management

● The Absolute Maximum Junction Temperature (T J ) must not be exceeded under any circumstances. The increase in the

temperature of an LED while in operation may vary depending on the PCB thermal resistance and the density of LEDs on the PCB

assembly. Ensure that when using the LEDs for the chosen application, heat is not concentrated in an area and properly managed

in the system/assembly.

● The operating current should be determined by considering the temperature conditions surrounding the LED (i.e. T A ). Ensure that

when operating the LED, proper measures are taken to dissipate the heat.

● The following two equations can be used to calculate the LED junction temperature:

1) T J =T A +R θJA ?1?1W 2) T J =T S +R θJS ?1?1W

*T J =LED Junction Temperature: °C

T A =Ambient Temperature: °C

T S =Soldering Temperature (Die Heat Sink): °C

R θJA =Thermal Resistance from Junction to Ambient: °C/W

R θJS =Thermal Resistance from Junction to T S Measurement Point: °C/W